As gavinzach has stressed this is a last ditch and also a one shot go at recovery. This process should not be repeated, why -
On the motherboard there are miniature SMD Electrolytic Capacitors, these are the tin can looking devices. They have a liduid inside, the electrolyte. When subject to this high temperature this will boil off. However they are desiged to tollerate a very short period of high temperature and within the limits of this oven bake depending on the age and condition of these capacitors they should survive.......no guarantees given.
On the extreme side these capacitors can swell and explode. So be warned.
I still have a preference to use a heat gun locally at the gpu, southbridge and northbridge chipset to remelt the BGA (ball grid array).
I am not trying to stop this process as it is so successful but take advice from gavinzach and the exact sequence and process pamook has laid down. Also take into account my warning with the capacitors.
Follow the instruction and times to the letter, do not be tempted to increase the temperature or time.
Myself and gavinzach will only recommend this procedure once all software and hardware issues have been attempted and exhausted.
ONE SHOT LAST DITCH. You have been warned!